2054
3D Integration and Reliability Challenges

Monday, October 28, 2013: 09:30
Union Square 21, Tower 3, 4th Floor (Hilton San Francisco Union Square)
Mitsumasa Koyanagi, PhD , Tohoku University, Sendai, Japan
Mariappan Murugesan, Ph.D. , Tohoku University
Kangwook Lee, Ph.D. , Tohoku University
Takafumi Fukushima, Ph.D. , Tohoku University
Tetsu Tanaka, Ph.D. , Tohoku University

Abstract:

See more of: Invited Talks 1
See more of: E7: Processing, Materials, and Integration of Damascene and 3D Interconnects 5
See more of: Dielectric and Semiconductor Materials, Devices, and Processing
<< Previous Abstract | Next Abstract >>