2069
Improvement of Adhesion Strength of Electrolessbarrier Layer and Its Application to TSV Process

Tuesday, October 29, 2013: 10:20
Union Square 21, Tower 3, 4th Floor (Hilton San Francisco Union Square)
Shoichiro Nishizawa, Bachelor of engineering , Kansai University, Suita, Japan
Shoso Shingubara , Kansai University, Osaka, Japan
Tomohiro Shimizu , Kansai University
Fumihiro Inoue, Ph.D , Tohoku University

Abstract:

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