2068
Copper Seed Layer Wet Etching for 3D Integration

Tuesday, October 29, 2013: 10:00
Union Square 21, Tower 3, 4th Floor (Hilton San Francisco Union Square)
Laurence Gabette , CEA-LETI MINATEC, Grenoble, France
Riadh Kachtouli , CEA-LETI MINATEC
Roselyne Segaud , CEA-LETI MINATEC
Pascal Besson , STMicroelectronics

Abstract:

  • E7-2068 (631.3KB) - Abstract Text
See more of: Three Dimensional Interconnections 2
See more of: E7: Processing, Materials, and Integration of Damascene and 3D Interconnects 5
See more of: Dielectric and Semiconductor Materials, Devices, and Processing
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