1883
X-ray Characterization of PEALD versus PVD Tantalum Nitride Barrier Deposition and the Impact on Via Contact Resistance

Thursday, October 31, 2013: 17:40
Continental 8, Tower 3, Ballroom Level (Hilton San Francisco Union Square)
Xunyuan Zhang , GLOBALFOUNDRIES, Inc., Albany, NY
O. van der Straten , IBM Research
Tibor Bolom , GLOBALFOUNDRIES, Inc.
Ming He , GLOBALFOUNDRIES, Inc.
J. Maniscalco , IBM Systems & Technology Group
Daniel Edelstein , IBM Research

Abstract:

  • E2-1883 (1048.4KB) - Abstract Text
See more of: Oxides and Conductors for Advanced Devices
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