Poster

Tuesday, October 29, 2013: 18:00-20:00
Grand Ballroom, Tower 2, Grand Ballroom Level (Hilton San Francisco Union Square)
2125
Selective Removal of Ashed Spin-On Glass (SOG)
Hsing-Chen Wu, Ph. D, ATMI Inc.; Sheng-Hung Tu, ATMI Inc.; E. Cooper, ATMI Inc.
2126
Non-Stiction Performance of Various Post Wet-Clean Drying Schemes on High-Aspect-Ratio Device Structures
Han-Wen Chen, Ph.D, Applied Materials, Inc.; Roman Gouk, Applied Materials, Inc.; Steven Verhaverbeke, Applied Materials, Inc.; Robert J. Visser, Applied Materials, Inc.
2127
Influence of Geometry, Edges and Roughness on Liquid Penetration and Removal During Wet Cleaning
C. W. Extrand, Entegris; Sung In Moon, Entegris
2128
Micro Unetched Oxide Defect during Buffered Oxide Etchant Process
SeungTaek Lim, Bachelor, Memory Cleaning/CMP Technology Team, Memory Division, Semiconductor Business, Samsung Electronics Co., LTD.,; Dukmin Ahn, Master, Memory Cleaning/CMP Technology Team, Memory Division, Semiconductor Business, Samsung Electronics Co., LTD.,; Kihyun Kim, Master, Memory Cleaning/CMP Technology Team, Memory Division, Semiconductor Business, Samsung Electronics Co., LTD.,; Heechan Jung, Bachelor, Memory Cleaning/CMP Technology Team, Memory Division, Semiconductor Business, Samsung Electronics Co., LTD.,; Byoungsu Lee, Bachelor, Memory Cleaning/CMP Technology Team, Memory Division, Semiconductor Business, Samsung Electronics Co., LTD.,; Huihwan Lee, Bachelor, Memory Cleaning/CMP Technology Team, Memory Division, Semiconductor Business, Samsung Electronics Co., LTD.,; Hasub Hwang, Memory Cleaning/CMP Technology Team, Memory Division, Semiconductor Business, Samsung Electronics Co., LTD.,
See more of: E8: Semiconductor Cleaning Science and Technology 13 (SCST 13)
See more of: Dielectric and Semiconductor Materials, Devices, and Processing
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