Current Topics in CMP

Tuesday, May 13, 2014: 15:40-16:50
Bonnet Creek Ballroom VII, Lobby Level (Hilton Orlando Bonnet Creek)
Chair:
G. Bahar Basim
15:40
1434
Current Status of Slurries and Cleans for CMP of III-V Device Fabrications – A Critical Review
G. Banerjee (Air Products and Chemicals Inc.)
16:00
1435
Application of Fluorescence Correlation Spectroscopy in the Characterization of Particle Size Distributions of Colloidal Silica Abrasives Used in Chemical-Mechanical Planarization
L. M. Jacobson (Bradley University, Bradley University), D. K. Turner (Bradley University), A. K. Rawat, C. T. Carver, A. Tripahi, M. Moinpour (Intel Corporation), and E. E. Remsen (Bradley University)
16:20
Concluding Remarks
 
1436
Development of Silicon Polish on 450mm CMP Tool (Cancelled)
See more of: P1: Chemical Mechanical Polishing 13
See more of: Electronic Materials and Processing
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