Electrode Material (General)

Wednesday, 8 October 2014: 08:10-12:00
Sunrise, 2nd Floor, Star Ballroom 1 (Moon Palace Resort)
Prashant N Kumta and Patrice Simon
Ion Intercalation into 2D Titanium Carbide Based MXenes: Applications for Electrochemical Capacitors
M. R. Lukatskaya, C. E. Ren, O. Mashtalir (Department of Materials Science and Engineering, Drexel University), Y. Dall'Agnese (Université Paul Sabatier, CIRIMAT), M. W. Barsoum (Department of Materials Science and Engineering, Drexel University), P. Simon (Université Paul Sabatier, CIRIMAT UMR CNRS 5085, 118 route de Narbonne, 31062 Toulouse, France), and Y. Gogotsi (Dept of Mat. Sci. and Eng., Drexel University)
In-Situ Atomic Force Microscopy Studies of Ti3C2: A Promising New Material for Electrochemical Capacitors
J. Black (Oak Ridge National Laboratory), M. Beidaghi (Drexel Nanomaterials institute, Department of Materials Science and Engineerring, Drexel University), S. V. Kalinin (Oak Ridge National Laboratory), Y. Gogotsi (Dept of Mat. Sci. and Eng., Drexel University), and N. Balke (Oak Ridge National Laboratory)
Double Layer and Pseudocapacitive Charge-Storage Mechanisms in Carbides and Nitrides
A. Djire, O. T. Ajenifujah, A. Sleightholme, P. Rasmussen, and L. T. Thompson (University of Michigan)
Polypyrrole/Carbon Paper Nanocomposite Films toward Free-Standing Electrochemical Capacitors
Z. Guo, H. Wei, Y. Wang, J. Guo (Integrated Composites Laboratory (ICL), Dan F. Smith Department of Chemical Engineering, Lamar University, Beaumont, TX 77710 USA), and S. Wei (Department of Chemistry and Biochemistry, Lamar University, Beaumont, TX 77710 USA)
New Insight in the Charge Storage Mechanism of Vanadium Nitride as a Pseudocapacitve Electrode
A. Morel (Institut des Matériaux Jean Rouxel, Université de Nantes, CNRS), T. Brousse (Institut des Matériaux Jean Rouxel, CNRS), and D. Bélanger (Université du Québec à Montréal)
Electrochemical Capacitors Fabricated Using Porous Silicon
D. S. Gardner, C. W. Holzwarth III, Y. Liu, S. B. Clendenning, W. Jin, Z. Chen, B. K. Moon, E. Hannah (Intel Corporation), C. Pint (Intel Corporation, Vanderbilt University), E. Mäkilä (University of Turku), C. Chen, C. Wang (Florida International University), and J. Gustafson (Intel Corporation, Ceranovo)
Doped Transition Metal Nitride Supercapacitors (DTMSCs): Mechanisms of Charge Storage
P. N. Kumta, P. Jampani, P. Patel (Department of Chemical and Petroleum Engineering, University of Pittsburgh), and O. I. Velikokhatnyi (University of Pittsburgh)
Influence of Surface Chemistry on Rheological and Electrochemical Properties in Flowable Electrodes
K. B. Hatzell, G. Housel, A. J. McBride, M. Boota, E. C. Kumbur (Drexel University), and Y. Gogotsi (Dept of Mat. Sci. and Eng., Drexel University)