(Invited) Characteristics of a Wire-Bonding-Less SiC Power Module Operating in a Wide Temperature Range

Wednesday, October 14, 2015: 14:30
Ellis East (Hyatt Regency)
S. Sato (AIST, Sanken Electric Co., Ltd.), H. Tanisawa (AIST, Sanken Electric Co., Ltd.), T. Anzai (AIST, Calsonic Kansei Corp.), H. Takahashi (AIST, FUJI ELECTRIC CO., LTD.), Y. Murakami (AIST, NISSAN MOTOR CO., LTD.), F. Kato, K. Watanabe (AIST), and H. Sato (AIST)

Using high-speed switching, wide bandgap semiconductor devices can reduce on-resistance in the on-state to realize low power converter losses. In addition, SiC power devices can be operated in high temperatures; thus, their cooling systems can be reduced in size or removed all together, thereby increasing the power density of the power converter. In this study, we designed and fabricated a SiC power module with a built-in snubber circuit. This power module is operable in high temperatures over 200 degrees C.

Design of Power Module for High-Temperature Operation

The manufactured power module, its components, and its circuit diagram are shown in Fig. 1. The module size is 30 × 44 × 29 mm3. Active metal brazing copper (AMC) substrates sandwich the four SiC-metal–oxide–semiconductor field-effect transistors (MOSFETs) in this structure. Two AMC substrates connect via the metal block. The C–R  snubber circuit is built-in on the surface of AMC1 (Fig. 1(b)). The SiC-MOSFET and AMC1 are joined by a flip-chip-bonding technique using an Al bump. The others are joined by Au–Ge solder. Fig. 2 shows the 50-kHz switching waveforms. Fig. 3 shows the circuit configuration for the Fig. 2 waveforms. This power module can realize high-speed switching in a fall time tf @ 25 ns. Surge voltage and ringing are suppressed by the built-in snubber circuit.


This work was supported by Council for Science, Technology and Innovation (CSTI), Cross-ministerial Strategic Innovation Promotion Program (SIP), "Next-generation power electronics/Consistent R&D of next-generation SiC power electronics", and "the Novel Semiconductor Power Electronics Project Realizing Low Carbon Emission Society" (funding agency: NEDO).