Metal Deposition and Applications I

Wednesday, October 14, 2015: 14:00-15:40
Phoenix East (Hyatt Regency)
Chairs:
O. van der Straten and Sean Thomas Barry
14:00
995
(Invited) Ru-Based Binary or Ternary Thin Films By Atomic Layer Deposition for a Seedless Cu Interconnects
S. H. Kim (Yeungnam University)
14:40
996
ALD TaN Barrier for Enhanced Performance with Low Contact Resistance for 14nm Technology Node Cu Interconnects
J. Nag, B. Cohen, S. Choi, A. Ogino, M. Oh, Y. Yan (IBM Semiconductor Research and Development Center), J. Liang, C. Christiansen, A. Kim, B. Li (IBM Corporation), P. DeHaven, A. Madan, S. Krishnan (IBM Semiconductor Research and Development Center), and A. H. Simon (IBM Semiconductor Research and Development Center)
 
997
On the Growth of Silver Thin Films By Atmospheric-Plasma Spatial ALD (Cancelled)
See more of: G01: Atomic Layer Deposition Applications 11
See more of: Electronic Materials and Processing
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