FEOL/BEOL: Materials and Processes

Tuesday, 31 May 2016: 08:00-12:40
Indigo 206 (Hilton San Diego Bayfront)
Chairs:
Vijay Narayanan and Evgeni Gusev
08:00
1173
(Invited) TmSiO as a CMOS-Compatible High-k Dielectric
E. Dentoni Litta, P. E. Hellström, and M. Östling (KTH Royal Institute of Technology)
08:40
1174
Low Leakage Current Al2O3 Metal-Insulator-Metal Capacitors Formed By Atomic Layer Deposition at Optimized Process Temperature and O2 Post Deposition Annealing
Y. Koda, H. Sugita, T. Suwa, R. Kuroda, T. Goto, A. Teramoto, and S. Sugawa (Tohoku University)
09:00
1175
(Invited) Low-Temperature Microwave-Based Plasma Oxidation of Ge and Oxidation of Silicon Followed by Plasma Nitridation
W. Lerch, T. Schick, N. Sacher, W. Kegel (centrotherm photovoltaics AG), J. Niess (HQ-Dielectrics GmbH), M. Czernohorsky, and S. Riedel (Fraunhofer IPMS-CNT)
09:40
Break
10:00
1176
(Invited) The (R)Evolution of the Junctionless Transistor
R. Duffy (Tyndall National Institute, University College Cork)
10:40
1177
Formation of Low-Resistivity Metal/Germanium Contact with Ultra-Thin Interlayer and Plasma Oxidation for n-Channel Germanium FET
G. S. Kim, S. H. Kim, J. Park, S. W. Kim, and H. Y. Yu (Korea University)
11:00
1178
(Invited) Pattern and Emissivity Insensitive Dopant Activation and Silicide Contact Formation Annealing in a Hot Wall Rapid Thermal Annealing System
W. S. Yoo (WaferMasters, Inc.)
11:40
1179
Height Uniformity of Micro-Bumps Electroplated on Thin Cu Seed Layers
L. Yang, J. Slabbekoorn, M. Honore, K. Stiers, H. Struyf (imec), P. M. Vereecken (KU Leuven), and A. Radisic (imec)
12:00
1180
Application of Process Simulation for Comparison of Contactless and Conventional Electrodeposition Methods for 3D Packaging
M. Zhao, K. Jakes, K. Luke, J. Kishore (University of Arizona), R. Gouk, S. Verhaverbeke (Applied Materials, Inc.), F. Shadman, and M. Keswani (University of Arizona)
12:20
1181
Vapor Phase Self-Assembled Monolayers for CMOS BEOL Barrier Layers
T. R. Naik, M. Ravikanth, and V. R. Rao (Indian Institute of Technology Bombay (IIT Bombay))
See more of: G02: Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 6
See more of: Electronic Materials and Processing
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