(Invited) Flexible Electronics for Low-Cost Applications: Process and Assembly Challenges

Wednesday, 4 October 2017: 11:00
Chesapeake C (Gaylord National Resort and Convention Center)
R. Bringans (PARC, a Xerox Company)
Flexible electronics promises to enable many novel applications in which the form factor and utility of the final device or product is no longer limited by the rigid nature of most electronic components. There are a number of challenges that need to be overcome for this technology to succeed. In this presentation, we will describe two key aspects: (i) process considerations for fabrication of flexible components and circuits and (ii) approaches to assembly of different components into the sub-systems that will make up the final device.