High Performance Device and Heterogeneous Integration 2

Wednesday, 4 October 2017: 10:30-12:30
Chesapeake C (Gaylord National Resort and Convention Center)
Chairs:
Gamal Refai-Ahmed and Matthias Wietsruck
10:30
1146
(Invited) Past, Present and Future Challenges of Thermal Management of Electronics Packaging
G. Refai-Ahmed (Xilinx)
11:00
1147
(Invited) Flexible Electronics for Low-Cost Applications: Process and Assembly Challenges
R. Bringans (PARC, a Xerox Company)
11:30
1148
(Invited) How to Integrate MEMS on Foundry-Fabricated CMOS Backplanes
M. Schulze, C. Hohle, and M. Friedrichs (Fraunhofer IPMS)
12:00
1149
(Invited) Detection of Bacterial Fluorescence by the Combination of MEMS Microfluidic Chip and Si Photodetector toward On-Chip Biological Sensing
S. Onishi, C. Y. Joon, M. Ishida, K. Sawada, H. Ishii (Toyohashi University of Technology), K. Machida, K. Masu (Tokyo Institute of Technology), Y. Nikaido, M. Saito (University of Occupational and Environmental Health), and S. Yoshida (Fukuoka Megumi Hospital)
See more of: G03: Semiconductor Process Integration 10
See more of: Electronic Materials and Processing
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