(Invited) Past, Present and Future Challenges of Thermal Management of Electronics Packaging

Wednesday, 4 October 2017: 10:30
Chesapeake C (Gaylord National Resort and Convention Center)
G. Refai-Ahmed (Xilinx)
The present and future use of the electronics devices of 7nm and beyond shall be supporting a complete heterogonous integration. This heterogonous integration will be more addressing the end customers need from system level point of view.

In the past few years there has been a tremendous increase in the power dissipation of the electronic devices especial general purpose GPU, CPU, as well as, FPGA in order to address the growing applications and support requirements for IoT features. In this talk, more discussion on the challenges of enabling heterogonous integration from thermal prospective will be given. This will be given based on the present thermal management devices of the present and future generation will be identified. The intent of this talk is to challenge the researchers on hot issues which need to be addressed on the coming five years.