Wet Etching and Contamination Removal

Tuesday, 3 October 2017: 15:40-17:20
Chesapeake I (Gaylord National Resort and Convention Center)
Paul W. Mertens and Anthony J. Muscat
Study of Copper Surface Preparation by Sequential Atomic Layer Wet Etching and Laser Annealing Treatments
A. Iwasaki, Y. Akanishi (SCREEN Semiconductor Solutions Co., Ltd.), F. Mazzamuto (SCREEN-LASSE, Gennevilliers, France), E. Kesters, Q. T. Le, and F. Holsteyns (imec)
Modification of DHF for Removal of Metals from Silicon Wafer
D. H. Lee, H. J. Song (Hanyang university), S. H. Jang, H. T. Kim (Hanyang University), J. H. Yi, E. S. Choi (LG Siltron), and J. G. Park (Hanyang University)
Electrolyzed Water for Selective Etching of Metals (Cancelled)