Thin Film Structure and Morphology Control

Thursday, 5 October 2017: 08:25-13:00
Chesapeake G (Gaylord National Resort and Convention Center)
Chairs:
Stanko Brankovic , Luca Magagnin and Timothy D. Hall
08:25
Welcoming Remarks
08:30
988
(Invited) Pulsed Electrodeposition of Refractory Metals in Ionic Liquids
A. Ispas, A. Endrikat, T. Engemann, R. Peipmann, and A. Bund (Technische Universität Ilmenau)
09:10
989
(Invited) Aluminum Layer Electrodeposition from Aqueous Solutions
J. D. Watkins (LumiShield Technologies), X. Zhou (LumiShield Technologies, Liquid Ion Solutions), and H. B. Nulwala (LumiShield Technologies, Carnegie Mellon University)
09:50
990
High Speed Blind Via Filling By Copper Electrodeposition
C. H. Lo and W. P. Dow (National Chung Hsing University)
10:10
991
Electrodeposition of Nickel Selenide Thin Films
D. Kutyla, K. Kolczyk, P. Zabinski, and R. Kowalik (AGH University of Science and Technology)
10:30
Intermission
10:40
992
(Invited) Electrodeposition of Metals and Alloys for Graphene Growth
L. Pedrazzetti, L. Nobili, and L. Magagnin (Politecnico di Milano)
11:20
993
Microvia Filling By Using Insoluble Anodes in an Acidic Copper Planting Bath with a Novel Accelerator
C. C. Liu and W. P. Dow (National Chung Hsing University)
11:40
994
Co-Ni Anomalous Codeposition Studies: Mechanism and Effects of Glycine
V. P. Graciano (National Institute of Standards and Technology) and S. I. Cordoba de Torresi (Universidade de Sao Paulo)
12:00
995
Effect of Surface Properties of Titanium Anode on Surface Brightness of Electrodeposited Copper Foil  
Y. C. Lin, C. H. Yen, and W. P. Dow (National Chung Hsing University)
12:20
998
(Invited) Low Wear Index Chromium Coatings Electroplated from a Functional Reach-Compliant Trivalent Chromium Chemistry
T. D. Hall, E. J. Taylor, M. Inman, S. Snyder, J. Xu, and R. Radhakrishnan (Faraday Technology, Inc.)
See more of: E05: Mechanics and Metallurgy of Electrodeposited Thin Films
See more of: Electrochemical/Electroless Deposition
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