Surfactant Mediated Nucleation and Growth 4

Tuesday, 15 May 2018: 14:00-18:00
Room 211 (Washington State Convention Center)
Peter Broekmann and Benjamin J. Wiley
Shape Control of Electrochemically Deposited Metal Films and Nanostructures through Additive Effects
G. W. Leach, S. V. Grayli, and Y. J. Han (Simon Fraser University)
Molecular-Level Analysis of Surface Species for Electrochemical Deposition Processes Using Density Functional Theory Calculations and Surface Enhanced Raman Microscopy with Plasmonic Sensors
T. Homma (Department of Applied Chemistry, Waseda University, Res. Org. for Nano&Life Innovation, Waseda University), M. Kunimoto, M. Bertz, and M. Yanagisawa (Res. Org. for Nano & Life Innovation, Waseda University)
Morphological Control in Solution-Deposited Silver Nanoplatelet Films
A. Vaskevich (Weizmann Institute of Science), F. Muench (Weizmann Institute of Science, Technische Universität Darmstadt), I. Kaplan-Ashiri, and I. Rubinstein (Weizmann Institute of Science)
Annealing-Free Copper Foil Due to Ultra-Large Grain Sizes after Electroplating
W. P. Dow and P. F. Chan (National Chung Hsing University)
Copper Plated through-Holes for 3D Electro-Thermal Systems
S. Taushanoff (NANO3D SYSTEMS, LCC), V. M. Dubin (NANO3D SYSTEMS LLC), A. Wallace, and H. A. Mantooth (University of Arkansas)
A Deeper Look at Bottom-up Copper Deposition in High Aspect Ratio through Silicon Vias
D. Josell, M. Silva, J. Kildon, and T. P. Moffat (NIST)