1890
Application of Atomic Layer Deposition Tungsten (ALD W) as Gate Filling Metal for 22 nm and Beyond Nodes CMOS Technology

Friday, November 1, 2013: 11:20
Continental 8, Tower 3, Ballroom Level (Hilton San Francisco Union Square)
Guilei Wang , Chinese Academy of Sciences, Beijing, China
Qiang Xu , Key Laboratory of Microelectronics Devices & Integrated Technology, Institute of Microelectronics of Chinese Academy of Sciences
Tao Yang, Doctor , Institute of Microelectronics of Chinese Academy of Sciences
Jun Luo, Doctor , Institute of Microelectronics of Chinese Academy of Sciences
Jinjuan Xiang , Institute of Microelectronics of Chinese Academy of Sciences
Jing Xu, Doctor , Institute of Microelectronics of Chinese Academy of Sciences
Gaobo Xu , Chinese Academy of Sciences
Chunlong Li , Institute of Microelectronics of Chinese Academy of Sciences
Junfeng Li , Institute of Microelectronics of Chinese Academy of Sciences
Jiang Yan , Institute of Microelectronics of Chinese Academy of Sciences
Chao Zhao , Institute of Microelectronics of Chinese Academy of Sciences
Dapeng Chen , Institute of Microelectronics of Chinese Academy of Sciences
Tianchun Ye , Institute of Microelectronics of Chinese Academy of Sciences

Abstract:

  • E2-1890 (1138.7KB) - Abstract Text