2065
A Study of Adopting Pure Tin Solder to Pillar Bump

Tuesday, October 29, 2013: 08:40
Union Square 21, Tower 3, 4th Floor (Hilton San Francisco Union Square)
Ui-Hyoung Lee, Ph.D. , Samsung Electronics, Thin Film Technology Team, Hwasung, South Korea
Moongi Cho, Ph.D. , Samsung Electronics
Woojin Choi, Ph.D. , Samsung Electronics
Ha-Young You, Master , Samsung Electronics
Jinho Choi, Undergraduate , Samsung Electronics, Thin Film Technology Team
Jaihyung Won, Ph.D. , Samsung Electronics, Thin Film Technology Team

Abstract:

  • E7-2065 (870.2KB) - Abstract Text
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