2081
CVD/ALD-Mn(Nx) As Copper Diffusion Barrier For Advanced Interconnect Technologies

Tuesday, October 29, 2013: 16:40
Union Square 21, Tower 3, 4th Floor (Hilton San Francisco Union Square)
Nicolas Jourdan , imec, Leuven, Belgium

Abstract:

  • E7-2081 (781.2KB) - Abstract Text
See more of: Copper Damascene Interconnections
See more of: E7: Processing, Materials, and Integration of Damascene and 3D Interconnects 5
See more of: Dielectric and Semiconductor Materials, Devices, and Processing
<< Previous Abstract | Next Abstract >>