Particle Removal

Monday, October 28, 2013: 10:00-12:00
Continental 8, Tower 3, Ballroom Level (Hilton San Francisco Union Square)
Chairs:
Richard E. Novak and Jerzy Ruzyllo
10:00
(Invited) Particle Cleaning Technologies to Meet Advanced Semiconductor Device Process Requirements
Harald F. Okorn-Schmidt, Lam Research AG; Frank Holsteyns, Lam Research AG; Alexander Lippert, Lam Research AG; David Mui, Lam Research; Mark Kawaguchi, Lam Research; Christiane Lechner, Institute of Fluid Mechanics and Heat Transfer, Vienna University of Technology, A-1040 Vienna, Austria; Philipp E. Frommhold, Christian-Doppler-Laboratory for Cavitation and Micro-Erosion, Drittes Physikalisches Institut Georg-August-Universität Göttingen, D-37077 Göttingen, Germany; Till Nowak, Christian-Doppler-Laboratory for Cavitation and Micro-Erosion, Drittes Physikalisches Institut Georg-August-Universität Göttingen, D-37077 Göttingen, Germany; Robert Mettin, Christian-Doppler-Laboratory for Cavitation and Micro-Erosion, Drittes Physikalisches Institut Georg-August-Universität Göttingen, D-37077 Göttingen, Germany
10:40
A Study of Nanoparticle Removal on Patterned Surfaces
Antoine Pacco, imec; Frank Holsteyns, imec; Stefan De Gendt, IMEC
 
2097
Evaluation of An Effective Wet Cleaning Method for Particle Removal on Various Thin Films (Cancelled)
11:20
Surface Cleaning Using CO2 Gas Cluster for Semiconductor Device
Yujin Cho, Department of Mechanical Engineering, SungKyunKwan University; Hoomi Choi, Doctor, Samsung electronics; Taesung Kim, Doctor, Sungkyunkwan University
11:40
A Multi-Frequency Megasonic System for Nano-Particle Removal
Hyunse Kim, Ph. D., Korea Institute of Machinery and Materials; Yanglae Lee, Korea Institute of Machinery and Materials; Euisu Lim, Korea Institute of Machinery and Materials