Photeresist Removal and Related Topics

Tuesday, October 29, 2013: 16:00-18:10
Continental 8, Tower 3, Ballroom Level (Hilton San Francisco Union Square)
Srini Raghavan and Richard E. Novak
All Wet Resist Strip for Improved Semiconductor Process and Product Improvement
Murli Bashyam, Texas Instruments Inc.; M. Satterfield, Texas Instruments Inc.; R. Gupta, Texas Instruments Inc.
Translation of Particles to Wafers during Spin Coating
C. W. Extrand, Entegris; Sung In Moon, Entegris; Loxie Monson, Entegris
Cryogenic Single-Component Micro-Nano Solid Nitrogen Particle Production Using Laval Nozzle for Physical Resist Removal-Cleaning Process
Jun Ishimoto, Ph.D, Institute of Fluid Science, Tohoku University; U Oh, MS, Hitachi, Ltd.; Tomoki Koike, Graduate School of Engineering, Tohoku University; Naoya Ochiai, Ph.D, Institute of Fluid Science, Tohoku University
Effects of Plasma and Wet Processes on Si-Rich Anti-Reflective Coating to Address Selective Trilayer Rework for Sub-20nm Technology Nodes
Olivier Pollet, CEA-LETI; Romain Sommer, CEA-LETI; Laurent Lachal, CEA-LETI; Sebastien Barnola, CEA-LETI; Come De Buttet, CEA-LETI; Claire Richard, ST Microelectronics; Cecile Jenny, ST Microelectronics
Characterization of the Descum Process for Various Silicon Substrates Doping
Chandra S Tiwari, Micron Technology Inc.; Yong Sheng Lim, Micron Technology Inc.; Ralph Fulton, Micron Technology Inc.; Jay Srinivasan, Micron Technology Inc.; Matt Gisinger, Micron Technology Inc.; Patrick Flynn, Micron Technology Inc.; Lai Ho Mak, Micron Technology Inc.
TiN Metal Hard Mask Removal with Selectivity to Tungsten and TiN Liner
Steven Lippy, Advanced Technology Materials Inc.; Li-Min Chen, Advanced Technology Materials Inc.; Brown Peethala, IBM Albany; David L Rath, IBM Thomas J Watson Research Center; Karl Boggs, Advanced Technology Materials Inc.; Muthumanickam Sankarapandian, IBM Albany; Evelyn Kennedy, Advanced Technology Materials Inc.
Concluding Remarks