Metrology for More-Than-Moore

Wednesday, May 14, 2014: 08:00-10:50
Union, Ground Level (Hilton Orlando Bonnet Creek)
Chairs:
Richard A Allen and Munehiro Tada
08:00
1414
(Invited) Metrology for 3D Integration
R. A. Allen (NIST), V. Vartanian (SEMATECH), D. Read (Boulder, Colorado), and W. Baylies (Baytech)
08:40
1415
(Invited) Microwave-Based Metrology Platform Development: Application of Broad-Band RF Metrology to Integrated Circuit Reliability Analyses
L. You, C. A. Okoro, J. J. Ahn, J. J. Kopanski, and Y. S. Obeng (NIST)
09:20
Break
09:40
1416
(Invited) Reference Materials 8096 and 8097 - The Microelectromechanical Systems 5-in-1 Reference Materials: Homogeneous and Stable
J. Cassard, J. Geist, and J. Kramar (NIST)
10:20
1417
Effect of Current Compliance on Resistive Switching Characteristics of Amorphous Ternary Rare Earth Oxide SmGdO3 Thin Films Grown by Pulsed Laser Deposition
P. Misra (University of Puerto Rico), Y. Sharma, and R. S. Katiyar (University Puerto Rico)
See more of: N3: More-Than-Moore
See more of: Dielectric Science and Materials
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