H03 Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 5

Lead Organizer: F. Roozeboom (Eindhoven University of Technology)

Co-organizers: E. P. Gusev (Qualcomm Technologies, Inc.) , Kuniyuki Kakushima (Tokyo Institute of Technology) , Vijay Narayanan (IBM T. J. Watson Research Center) , P. J. Timans (Thermal Process Solutions Ltd.) , Stefan De Gendt (imec vzw) and Zia Karim (AIXTRON Inc)

Monday, 25 May 2015

08:30-09:30


Plenary Session
Conference Room 4M
Chair(s): F. Roozeboom

10:00-12:20


Si Nanowires and SiGe Based High Mobility Substrates
Conference Room 4M
Chair(s): Vijay Narayanan and P. J. Timans

14:00-16:00


Beyond CMOS Devices
Conference Room 4M
Chair(s): Kuniyuki Kakushima

Tuesday, 26 May 2015

08:20-12:00


III-V based High Mobility Substrates
Conference Room 4M
Chair(s): Evgeni Gusev and Vijay Narayanan

13:40-17:40


Process Integration
Conference Room 4M
Chair(s): F. Roozeboom and P. J. Timans

Wednesday, 27 May 2015

08:20-12:00


Memory/Optical/Photonic Applications
Conference Room 4M
Chair(s): Kuniyuki Kakushima and Evgeni Gusev

13:30-14:30


Electrical and Physical Characterization Techniques
Conference Room 4M
Chair(s): P. J. Timans

18:00-20:00