H03 Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 5
H03 Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 5
Sponsor(s):
Electronics and Photonics,
Dielectric Science and Technology
Lead Organizer: F. Roozeboom (Eindhoven University of Technology)
Co-organizers: E. P. Gusev (Qualcomm Technologies, Inc.) , Kuniyuki Kakushima (Tokyo Institute of Technology) , Vijay Narayanan (IBM T. J. Watson Research Center) , P. J. Timans (Thermal Process Solutions Ltd.) , Stefan De Gendt (imec vzw) and Zia Karim (AIXTRON Inc)