Process Integration

Tuesday, 26 May 2015: 13:40-17:40
Conference Room 4M (Hilton Chicago)
Chairs:
F. Roozeboom and P. J. Timans
13:40
1375
Ion Implantation Applications for Advanced Device Scaling
N. Variam and H. J. L. Gossmann (Applied Materials)
14:20
1376
Heated Ion Implantation Technology for High Performance Metal-Gate/High-k CMOS SOI Finfets
W. Mizubayashi (National Institute of AIST), H. Onoda, Y. Nakashima (Nissin Ion Equipment Co., Ltd.), Y. Ishikawa, T. Matsukawa, K. Endo, Y. Liu, S. O'uchi, J. Tsukada, H. Yamauchi, S. Migita, Y. Morita, H. Ota, and M. Masahara (National Institute of AIST)
15:00
1377
(Invited) Plasma Etching Technology Challenges for Future CMOS Fabrication Based on Microwave ECR Plasma
M. Izawa, M. Tanaka, N. Yasui (Hitachi High-Technologies Corp.), and M. Morimoto (Hitachi High-Technologies Taiwan Corporation)
15:40
Break
16:00
1378
Effect of Hydrogen on Silicon Nitrides Formation by Microwave Excited Plasma Enhanced Chemical Vapor Deposition
A. Teramoto, Y. Nakao, T. Suwa, K. Hashimoto (Tohoku University), T. Motoya (Mitsubishi Electric Corporation), M. Hirayama, S. Sugawa, and T. Ohmi (Tohoku University)
16:20
1379
(Invited) Plasma Processes for Emerging Silicon-Based MEMS, NEMS and Packaging Applications
M. E. McNie (Oxford Instruments)
17:00
1380
Enhanced Equipment and New Processes As Enabler for Power Technologies on 300mm Substrates
M. Engelhardt, J. Baumgartl, G. Denifl, G. Ehrentraut, M. Kuenle, M. Stadtmueller, S. Werner (Infineon Technologies Austria AG), D. Crippa (LPE Milano), and M. Kraft (CTR Villach)
17:20
1381
Influence of Annealing Condition on TSV Pumping and Microstructure Evolution
X. Jing (National Center for Advanced Packaging, Institute of Microelectronics Chinese Academy of Science), U. H. Lee (Memory Thin Film Technology Team, Samsung Electronics), C. Xu, Z. Niu, C. Song, W. Zhang (National Center for Advanced Packaging), J. Y. Bae, and J. Won (Memory Thin Film Technology Team, Samsung Electronics)
See more of: H03: Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 5
See more of: Electronic and Photonic Devices and Systems
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