Stress in Electrodeposited Films and Nanostructures

Tuesday, 3 October 2017: 14:00-17:00
Chesapeake H (Gaylord National Resort and Convention Center)
Chairs:
Gery R. Stafford and Natasa Vasiljevic
14:00
911
(Invited) Stress in Electrodeposited Ni and Cu: Understanding the Effects of Deposition Conditions and Microstructure
E. Chason, Z. Rao, and A. Engwall (Brown University School of Engineering)
14:40
912
(Invited) Interpretation of Certain Features of the Interface Stress vs. Electrode Potential Curves of Gold with the Help of Dual Dynamic Voltammetry
G. G. Láng, N. Kovács (Eotvos Lorand University, Institute of Chemistry), Z. Dankházi (Eotvos Lorand University, Institute of Physics), S. Vesztergom, and M. Ujvári (Eotvos Lorand University, Institute of Chemistry)
15:20
913
In-Situ Measurements of Stress during Electrodeposition of Copper Nanofilms: Effects of Deposition Rate and Grain Size
J. A. Murphy, C. Lenihan (Department of Physics, University of Limerick, Bernal Institute, University of Limerick, Ireland), R. P. Lynch (Department of Physics, University of Limerick, Ireland, Dept. of Chem. Eng., Case Western Reserve University), E. Chason (Brown University School of Engineering), and D. N. Buckley (Physics Dept., Bernal Institute, University of Limerick, Bernal Institute, University of Limerick, Ireland)
15:40
Intermission
16:00
914
Dynamic Stress Analysis Applied to the Underpotential Deposition of Copper Onto (111)-Textured Au
G. R. Stafford and U. Bertocci (National Institute of Standards and Technology)
16:20
915
(Invited) Role of Stress Induced By Anion Incorporation in Formation of Porous Anodic Alumina Films
Q. Dou (Iowa State University), Q. Van Overmeere (Université catholique de Louvain), S. Ide, P. Mishra, P. Shrotriya, and K. Hebert (Iowa State University)
See more of: E01: Fundamentals of Electrochemical Growth from UPD to Microstructures 4
See more of: Electrochemical/Electroless Deposition
<< Previous Session | Next Session >>