Non-Silicon Materials: Etching, Cleaning, and Conditioning

Wednesday, October 14, 2015: 09:00-12:30
104-A (Phoenix Convention Center)
Paul W Mertens and Anthony J. Muscat
Introductory Remarks
Surface Chemistry of III-V Semiconductors After Wet Etching with HCl and H2O2
P. Mancheno-Posso (University of Arizona) and A. J. Muscat (University of Arizona)
Nanoscale Etching: Dissolution of III-As and Ge in HCl/H2O2 Solutions
D. H. van Dorp (IMEC), D. Weinberger (University of Gent), S. Van Wonterghem (KUL), S. Arnauts (Imec), K. Strubbe (University of Gent), F. Holsteyns (imec), and S. De Gendt (imec)
Chemical Treatments for Native Oxides Removal of GaAs Wafers
M. Rebaud (CEA, LETI, MINATEC Campus), M. C. Roure, V. Loup (CEA-LETI MINATEC Campus), P. Rodriguez (CEA, LETI, MINATEC Campus), E. Martinez (CEA, LETI, MINATEC Campus), and P. Besson (STMicroelectronics)
Cleaning of InGaAs and InP Layers for Nanoelectronics and Photonics Contact Technology Applications
P. Rodriguez (CEA LETI), L. Toselli, E. Ghegin (CEA LETI, STMicroelectronics), M. Rebaud, N. Rochat, N. Chevalier, E. Martinez (CEA LETI), and F. Nemouchi (CEA LETI)
Chemical Passivation of In0.53Ga0.47As(100) Using Ammonium Sulfide and Thiols
Y. Contreras (University of Arizona) and A. J. Muscat (University of Arizona)
Wet Processing for Post-epi & Pre-furnace Cleans in Silicon Carbide Power MOSFET Fabrication (Cancelled)
Dissolution of Germanium in Sulfuric Acid Based Solutions
N. Gan, Y. Ogawa, T. Nagai (Kurita Water Industries LTD.), T. Masaoka (Kurita Water Industries LTD.), K. Wostyn, F. Sebaai, F. Holsteyns (imec), and P. W. Mertens (imec)
Concluding Remarks
Cofee Break