3D Integration

Tuesday, 3 October 2017: 14:00-15:50
Chesapeake C (Gaylord National Resort and Convention Center)
Chairs:
Sébastien Kerdilès and Jin Kawakita
14:00
1133
(Invited) Conductive Polymer/Metal Composite for Filling of TSV
J. Kawakita and T. Chikyow (National Institute for Materials Science)
14:30
1134
(Invited) Sequential 3D Process Integration: Opportunities for Low Temperature Processing
S. Kerdilès (Univ. Grenoble Alpes, CEA, LETI, 38000 Grenoble, France, Université Grenoble Alpes, Grenoble, France), P. Acosta-Alba (Université Grenoble-Alpes, CEA-LETI, Université Grenoble Alpes, Grenoble, France), B. Mathieu (CEA-LITEN, Grenoble, France, Université Grenoble Alpes, Grenoble, France), M. Veillerot, H. Denis, F. Aussenac (CEA-LETI, Grenoble, France, Université Grenoble Alpes, Grenoble, France), F. Mazzamuto, I. Toque-Tresonne, K. Huet (SCREEN-LASSE, Gennevilliers, France), M. P. Samson (STMicroelectronics, Crolles, France), B. Previtali, L. Brunet, P. Batude, and C. Fenouillet-Beranger (CEA-LETI, Grenoble, France, Université Grenoble Alpes, Grenoble, France)
15:00
1135
Three-Layered Stacking Process by Au/SiO2 Hybrid Bonding for 3D Structured Image Sensors
Y. Honda, M. Goto, T. Watabe, K. Hagiwara, M. Nanba, Y. Iguchi (NHK Science and Technology Research Laboratories), T. Saraya (The University of Tokyo), M. Kobayashi (Institute of Industrial Science, The University of Tokyo), E. Higurashi, H. Toshiyoshi (The University of Tokyo), and T. Hiramoto (Institute of Industrial Science, The University of Tokyo)
15:20
1136
Topographic Complexities and Solutions for High Density BEOL MIM Capacitors
L. Cheng, S. Kakita, R. Fox, E. Motoyama, J. Lee, N. Azad, G. Hart, S. Ham, A. Sharma, F. Beaudoin, G. W. Zhang, E. G. de la Garza, P. Babighian, T. Wang, X. Yang, R. Augur, and T. J. Tang (GLOBALFOUNDRIES)
15:40
Break
See more of: G03: Semiconductor Process Integration 10
See more of: Electronic Materials and Processing
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