3D Integration

Tuesday, 3 October 2017: 14:00-15:50
Chesapeake C (Gaylord National Resort and Convention Center)
Chairs:
Sébastien Kerdilès and Jin Kawakita
14:00
(Invited) Conductive Polymer/Metal Composite for Filling of TSV
J. Kawakita and T. Chikyow (National Institute for Materials Science)
14:30
(Invited) Sequential 3D Process Integration: Opportunities for Low Temperature Processing
S. Kerdilès, P. Acosta-Alba, B. Mathieu, M. Veillerot, H. Denis, F. Aussenac (CEA-LETI, Grenoble, France, Université Grenoble Alpes, Grenoble, France), F. Mazzamuto, I. Toque-Tresonne, K. Huet (SCREEN-LASSE, Gennevilliers, France), M. P. Samson (STMicroelectronics, Crolles, France), B. Previtali, L. Brunet, P. Batude, and C. Fenouillet-Beranger (CEA-LETI, Grenoble, France, Université Grenoble Alpes, Grenoble, France)
15:00
Three-Layered Stacking Process by Au/SiO2 Hybrid Bonding for 3D Structured Image Sensors
Y. Honda, M. Goto, T. Watabe, K. Hagiwara, M. Nanba, Y. Iguchi (NHK Science and Technology Research Laboratories), T. Saraya, M. Kobayashi, E. Higurashi, H. Toshiyoshi, and T. Hiramoto (The University of Tokyo)
15:20
Topographic Complexities and Solutions for High Density BEOL MIM Capacitors
L. Cheng, S. Kakita, R. Fox, E. Motoyama, J. Lee, N. Azad, G. Hart, S. Ham, A. Sharma, F. Beaudoin, G. W. Zhang, E. G. de la Garza, P. Babighian, T. Wang, X. Yang, R. Augur, and T. J. Tang (GLOBALFOUNDRIES)
15:40
Break