Pattern Collapse-related Issues and Their Solutions

Monday, 2 October 2017: 10:00-12:20
Chesapeake I (Gaylord National Resort and Convention Center)
Chairs:
Paul W. Mertens and Stijn F. L. Mertens
10:00
1056
(Invited) Wetting, Adhesion and Stiction of 2D Materials
S. F. L. Mertens (KU Leuven, TU Wien)
10:40
1057
Ultimate Limits of Pattern Stability Due to Thermal Vibrations
D. W. Bassett and A. Rotondaro (Tokyo Electron America)
11:00
1058
Surface Treatment Method and Its Metrology for Preventing Pattern Collapse
C. Bai, J. Wang, and E. Shalyt (ECI Technology)
11:20
1059
Solid Phase Clean: Improving Performance for Smaller Particle Removal without Pattern Damage and Film Loss
M. Aibara, K. Sekiguchi (Tokyo Electron Kyushu Ltd.), M. Kaneko (Tokyo Electron Technology Solutions Ltd.), D. W. Bassett (Tokyo Electron America), and I. Kanno (Tokyo Electron Ltd.)
11:40
1060
Nano-Structures Stiction Suppression by Molecular Structure Optimized Surface Energy Reduction Agent
T. Koide, S. Kimura, H. Iimori, T. Sugita, K. Sato (Toshiba Memory), S. Kumon, Y. Terui, Y. Okumura (Central Glass Co., Ltd.), and Y. Ogawa (Toshiba Memory)
12:00
1061
An Accurate Method for Determining Pattern Collapse Occurrence for Nano-Structures
H. Marumoto and H. Kawano (Tokyo Electron Kyushu Limited)
See more of: G01: 15th International Symposium on Semiconductor Cleaning Science and Technology (SCST 15)
See more of: Electronic Materials and Processing
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