Wet Etching and Cleaning

Monday, October 28, 2013: 14:00-16:40
Continental 8, Tower 3, Ballroom Level (Hilton San Francisco Union Square)
Chairs:
Srini Raghavan and Harald F. Okorn-Schmidt
14:00
2100
Numerical Calculation Model of Single Wafer Wet Etcher Using Swinging Nozzle
Hitoshi Habuka, Dr., Yokohama National University; Shintaro Ohashi, Mr., Yokohama National University; Kosuke Mizuno, Mr., Yokohama national University; Tetsuo Kinoshita, Mr., Pre-Tech
14:20
2101
Silicon and SiGe Alloys Wet Etching Using TMAH Chemistry
Virginie Loup, CEA-LETI MINATEC; Laurence Gabette, CEA-LETI MINATEC; Marie-Christine Roure, CEA-LETI MINATEC; Riadh Kachtouli, CEA-LETI MINATEC; Marine Jourdan, CEA-LETI MINATEC; Pascal Besson, STMicroelectronics; Sebastien Petitdidier, STMicroelectronics
14:40
2102
A Study on the Removal Method of Si Residue during Si Wet Etching
Kihyung Ko, Samsung Electronics Co. ; Sungkunkwan University; Hayoung Jeon, Process Development Team, Semiconductor R&D Center, Samsung Electronics Co; Myunggeun Song, Process Development Team, Semiconductor R&D Center, Samsung Electronics Co; Jeongnam Han, Samsung Electronics Co.; Boun Yoon, Process Development Team, Semiconductor R&D Center, Samsung Electronics Co; Siyoung Choi, Ph.D, SAMSUNG ELECTRONICS Co., Ltd.; Hokyu Kang, Samsung Electronics Co.; Chilgi Lee, Doctor, School of Information and Communication Engineering, Sungkyunkwan University; Taesung Kim, Doctor, Sungkyunkwan University
15:00
2103
Effect of Surface Wettability on Frictional Conditions of PVA Roll Brushes
Yoshitaka Hara, Shizuoka University; Toshiyuki Sanada, Shizuoka University; Akira Fukunaga, Ebara Corporation; Hirokuni Hiyama, Ebara Corporation
15:20
2104
Use of a Simple Cavitation Cell Set-Up with Replaceable Single Band Filters for Analysis of Sonoluminescence Signal from Megasonic Irradiated Gasified Aqueous Solutions
Zhenxing Han, Ph.D, University of Arizona; Manish Keswani, Ph.D, University of Arizona; Eric Liebscher, Product Systems Inc; Mark Beck, Product Systems Inc; Srini Raghavan, University of Arizona
15:40
2105
Numerical Study of Single Bubble Dynamics in Megasonic Field for New Physical Cleaning Method
Naoya Ochiai, Ph.D, Institute of Fluid Science, Tohoku University; Jun Ishimoto, Institute of Fluid Science, Tohoku University
16:00
2106
Challenges and Solutions for 450mm FEOL Wet Clean Tool
Bill Yu, Ph.D, G450C; Felix Ku, G450C; Charles Taft, G450C; Anne-Sophie Larrea, G450C; John Lin, Ph.D, G450C; Toyohide Hayashi, Dainippon Screen; Akira Morita, Dainippon Screen; Kenichiro Arai, Dainippon Screen; Hideji Naohara, Dainippon Screen
16:20
2107
Chemical Improvement of EUV Ruthenium Capping Layer Against Active Oxygen and Hydroxyl Radicals
Hanshin Lee, Samsung Electronics; Jaehyuck Choi, Samsung Electronics; Soowan Koh, Samsung Electronics; Jinsu Kim, Samsung Electronics; Dohyung Kim, Samsung Electronics; Junyoul Choi, Samsung Electronics; Hyoyeon Kim, Samsung Electronics; Hyungho Ko, Samsung Electronics; Byung Gook Kim, Samsung Electronics; Chan-Uk Jeon, Samsung Electronics
See more of: E8: Semiconductor Cleaning Science and Technology 13 (SCST 13)
See more of: Dielectric and Semiconductor Materials, Devices, and Processing
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